The Scaling Bottleneck in Advanced CMOS
As advanced CMOS implementation become increasingly wire-dominated, performance is limited not by logic density but by:
Routing congestion
Wire-dominated delay
Memory bandwidth constraints
Data-movement overhead
In highly parallel compute engines, these factors limit clock frequency, increase power consumption, and restrict scalability. Conventional architectures struggle to sustain tens of Gbps throughput within strict power and area budgets.
Routing-Aware Cross-Layer Co-Design
XCEL ASICs addresses these bottlenecks through tightly integrated cross-layer optimization that combines:
By co-optimizing algorithm, architecture, and implementation, we enable scalable ultra-high-throughput silicon optimized for performance, power, and area efficiency.

Our current portfolio includes high-performance error-correction IP cores engineered for advanced communication applications. These implementations are developed using routing-aware architectures, cross-layer co-design, and deep physical implementation optimization techniques that extend to other ultra-high-throughput communication and compute systems. Recent innovations include:
An ultra-high-throughput WiFi LDPC decoder — designed to meet next-gen connectivity demands,
An area-efficient high-throughput LDPC decoder for 5G-NR with full standard compliance,
A multi-Gbps LDPC decoder for WiGig (60 GHz) wireless systems,
An optimized 5G-NR polar decoder, engineered for performance and low latency.
XCEL ASICs has developed a high-performance, multi-Gbps Low-Density Parity-Check (LDPC) decoder IP for 5G New Radio (5G NR), supporting all block lengths and both base graphs defined in the 5G NR standard. Leveraging routing-aware co-optimization of algorithms, architecture, and circuits, the decoder delivers high throughput, low latency, and efficient silicon area and energy utilization. It supports scalable implementations across process nodes and meets the demanding data-rate requirements of 5G NR, targeting up to 10 Gbps uplink and 20 Gbps downlink.
ASIC development and FPGA prototyping for communication, AI, and DSP applications,
Simulation and verification of ASICs and standalone IP cores,
Synthesis, placement, and routing of digital blocks for ASIC tapeout,
Design, simulation, and implementation of digital communication, AI, or DSP systems.